10/28/2022 0 Comments Smd components identification pdfObviously different SMT packages are used for different types of components, but the fact that there are standards enables activities such as printed circuit board design to be simplified as standard pad sizes and outlines can be prepared and used.Īdditionally the use of standard size packages simplifies the manufacture because pick and place machines can use standard feed for the SMT components, considerably simplifying the manufacturing process and saving costs. One aspect of this is the surface mount technology component packages. The organisation has over 300 member companies, many of which are some of the largest electronics companies.The letters JEDEC stand for Joint Electron Device Engineering Council, and as the name indicates it manages and develops many standards associated with semiconductor devices of all types. The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organisation and standardisation body. Accordingly the sizes of most SMT components conform to industry standards like the JEDEC specifications. Industry standards are used to provide a large degree of conformity across the industry. Components are successively removed as they are required. Very large ICs, possibly quad flat packs, QFPs and plastic leaded chip carriers, PLCCs may be held in what is called a waffle pack which is placed onto the pick and place machine. Other components like dual in line surface mount ICs may be held in a tube from which they can be removed as required, and then under gravity the next one slides down. The reel consists of a tape within which the components are held and a second tape is loosely stuck onto the back As the machine uses components, so the retention tape is pulled off exposing the next component to be used. Larger surface mount components like resistors and capacitors as well as many surface mount diodes and transistors may be held in a tape on a reel. Often the very smallest components are held loose in a hopper and these are fed down a tube and picked out as required. The SMT package styles have been developed to provide easy handling during the shipping and stock stages of the supply chain, and then by the pick and pale machines used for PCB assembly.Įnsuring the components can be handled easily at all stages, ensures that manufacturing costs are reduced, and the quality of the assembled PCBs and the final equipment is as high as possible. As the whole aim of surface mount technology was that it should facilitate automated PCB assembly, the packages needed to be designed so that they could be manipulated on pick and place machines easily. When the surface mount packages were developed, one of the considerations that was given was that of component handling. Printed circuit board with a variety of SMT packages as well as through hole mounted connectors Requirements for PCB component handling These SMD resistors and capacitors these come in small rectangular packages, some of which are absolutely minute.Īdditionally there is a variety of different SMT packages for integrated circuits dependent upon the level of interconnectivity required, the technology being used and a variety of other factors.Ī number of other components are available, some of which are in standard packages, but others, because of their very nature need specialised packages with non-standard outlines. Some of the most widely used components are surface mount resistors and surface mount capacitors. These surface mount components come in a variety of packages, most of which are standardised to make the manufacture of the PCB assemblies using automated equipment much easier. As virtually all mass produced electronics uses surface mount technology: surface mount components are of great importance Surface mount devices, SMDs, or SMT components come in a variety of packages. What is SMT SMD packages Quad flat pack, QFP Ball grid array, BGA Plastic leaded chip carrier, PLCC SMT / SMD Components & packages, sizes, dimensions, details SMT components or SMDs have a number of standardised packages including 1206, 0805, 0603, 0403, 0201, SOT, SOIC, QFP, BGA, etc.
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